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From taking industry-designed courses and gaining hands-on experience through corporate internships to becoming process engineers after graduation, the first cohort of students in National University of Kaohsiung’s (NUK) Corporate Semiconductor Programs is gradually turning classroom learning into real-world industry experience as the initiative marks its first anniversary.

NUK has partnered with TSMC, Zhen Ding Technology, and Winbond? to connect key segments of the semiconductor value chain, spanning wafer manufacturing, printed circuit boards (PCBs) and substrates, and semiconductor packaging and testing. On September 7, NUK held an information session for the new academic year, officially launching the second year of its corporate semiconductor talent development initiative and further strengthening the final link between on-campus learning and career opportunities in leading industries.

NUK President Chi-Jen Chen noted that semiconductor clusters in southern Taiwan are developing rapidly, and university talent development must go beyond the classroom. Students need opportunities to understand industry needs and experience real workplace environments while they are still in school. Since the 2018 academic year, NUK has offered its Semiconductor Manufacturing Program. In recent years, the university has further integrated TSMC’s Semiconductor Program, Zhen Ding Technology’s AI Smart PCB Program and Hua Tai Electronics' Packaging and Testing Program, gradually establishing an industry-oriented curriculum covering the semiconductor value chain from wafer manufacturing to PCBs and substrates, and packaging and testing. This enables students to understand different stages of the industry while exploring their professional interests and career directions at an earlier stage.

Hsin-Che Chen, Senior Manager of Taiwan Human Resources Operations at TSMC, said that the explosive growth of the semiconductor and AI industries has created an urgent demand for talent. The TSMC–NUK program breaks away from traditional educational frameworks by involving the company directly in curriculum planning. Students who complete the program can systematically develop core knowledge in semiconductor processes and device physics, while also gaining priority access to training opportunities at TSMC’s New Employee Training Center during their university years. More than simply a curriculum, the program serves as an industry gateway that is highly valued by corporate managers.

NUK Academic Affairs Director Sung-Mao Wu pointed out that as Moore’s Law slows, advanced packaging and heterogeneous integration have become critical to sustaining semiconductor performance. To address challenges involving high-frequency and high-speed applications, thermal management, and signal integrity, NUK has partnered with major substrate manufacturer Zhen Ding Technology and semiconductor packaging and testing company Hua Tai Electronics to launch the AI Smart PCB Program and Packaging and Testing Program, respectively. The curricula focus on advanced substrate technologies, IC packaging processes, and system-level testing, allowing students to engage directly with some of the industry’s most cutting-edge technological challenges. The corporate partners also provide industry instructors and extensive practical resources, with high-performing students potentially able to achieve a seamless transition from graduation to employment.

During the first year of implementation, the three corporate programs attracted more than 550 registrations in total. In addition to on-campus courses, approximately 150 participants have taken part in practical learning opportunities through corporate visits, new employee training centers, and other activities. Some students have also completed the programs and received corporate certificates of completion. The results of the initiative are becoming increasingly visible as students progress from coursework and corporate learning to internships and employment.

Shang-Chen Chuang of NUK’s Department of Chemical and Materials Engineering participated actively in the corporate semiconductor programs during his studies. In addition to completing Zhen Ding Technology’s AI Smart PCB Program, he earned a certificate of completion from TSMC’s Semiconductor Program and accumulated practical experience through corporate engagement. After graduation, he joined Zhen Ding Technology’s Flexible Printed Circuit (FPC) Business Division as a Process Engineer. His journey—from coursework and corporate certification to full-time employment—provides a concrete example of how the program connects university education with the semiconductor industry.

Electrical Engineering student Yi-Ling Li has followed a different learning pathway. During her junior year, she took the required course Introduction to Printed Circuit Boards under Zhen Ding Technology’s program and served as a teaching assistant, continuing to strengthen her professional skills through laboratory work on campus. This year, she participated in NUK’s semiconductor talent-matching event, where face-to-face discussions with corporate recruiters helped her recognize that companies value not only technical expertise but also attitude, communication skills, and initiative in learning. The experience prompted her to rethink how she should prepare for her career. She subsequently secured an internship opportunity with Zhen Ding Technology and completed the corporate internship during this summer vacation, progressing from the classroom and laboratory to direct engagement with the industrial workplace.

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@Office of Research and Development @Center for Advanced Packaging and Integration Technologies | Teaching and Curriculum